Strength of joints produced by transient liquid phase bonding in the Cu-Sn system

TitleStrength of joints produced by transient liquid phase bonding in the Cu-Sn system
Publication TypeJournal Article
Year of Publication2005
AuthorsBosco, NS, and FW Zok
JournalACTA MATERIALIA
Volume53
Pagination2019-2027
Date PublishedAPR
ISSN1359-6454
DOI10.1016/j.actamat.2005.01.013