| Title | Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn system |
| Publication Type | Journal Article |
| Year of Publication | 2004 |
| Authors | Bosco, NS, and FW Zok |
| Journal | ACTA MATERIALIA |
| Volume | 52 |
| Pagination | 2965-2972 |
| Date Published | JUN 7 |
| ISSN | 1359-6454 |
| DOI | 10.1016/j.actamat.2004.02.043 |