| Title | Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys |
| Publication Type | Journal Article |
| Year of Publication | 2016 |
| Authors | G. Kim, X. Chai, L. Yu, X. Cheng, and D.S. Gianola |
| Journal | Scripta Materialia |
| Volume | 123 |
| Pagination | 113–117 |
| Date Published | 10/2016 |
| DOI | 10.1016/j.scriptamat.2016.06.008 |
