Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys

TitleInterplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys
Publication TypeJournal Article
Year of Publication2016
AuthorsG. Kim, X. Chai, L. Yu, X. Cheng, and D.S. Gianola
JournalScripta Materialia
Volume123
Pagination113–117
Date Published10/2016
DOI10.1016/j.scriptamat.2016.06.008