Title | Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys |
Publication Type | Journal Article |
Year of Publication | 2016 |
Authors | G. Kim, X. Chai, L. Yu, X. Cheng, and D.S. Gianola |
Journal | Scripta Materialia |
Volume | 123 |
Pagination | 113–117 |
Date Published | 10/2016 |
DOI | 10.1016/j.scriptamat.2016.06.008 |