Printing methods and materials for large-area electronic devices

TitlePrinting methods and materials for large-area electronic devices
Publication TypeJournal Article
Year of Publication2005
AuthorsM.L. Chabinyc, W.S. Wong, A.C. Arias, S.E. Ready, R.A. Lujan, J.H. Daniel, B Krusor, R.B. Apte, A. Salleo, and R.A. Street
JournalPROCEEDINGS OF THE IEEE
Volume93
Pagination1491-1499
Date PublishedAUG
ISSN0018-9219
Keywordsamorphous silicon, flat-panel display, polymer semiconductors, thin-film transistor
AbstractTwo digital printing methods for the fabrication of active matrix thin-film transistor (AM-TFT) backplanes for displays are described. A process using printed resists layers, referred to as digital lithography was used to fabricate arrays of hydrogenated amorphous silicon TFTs. TFTs were also fabricated using a combination. on of digital lithography to pattern metals and inkjet printing to pattern and deposit a polymeric semiconducting layer The relative performance of amorphous silicon and polymer TFTs were evaluated. The utility of digital lithographic processing was demonstrated by the fabrication of prototype reflective displays using electrophoretic media.
DOI10.1109/JPROC.2005.851492