@article {1566,
	title = {Serial sectioning in the SEM for three dimensional materials science},
	journal = {Current Opinion in Solid State and Materials Science},
	year = {2020},
	pages = {100817},
	abstract = {<p>
	Here we explore the range of serial sectioning techniques that have evolved over the past decade, providing a comprehensive toolkit for capturing rich 3D microstructures, chemistries and crystallographic information, with sub-micron resolution at volumes that extend out to mm3 or even cm3. In each case we consider the challenges associated with their application, the volumes they can analyze, the damage to the surface they impart, and their suitability for different materials. In certain cases these warrant hybrid methods, motivating workflows that leverage multiple sectioning modes within the same instrument. Finally, we provide a perspective on their future development, including advances in data collection, segmentation, registration, data fusion, and correlative microscopy. Furthermore, the exploitation of 3D techniques for a better understanding of existing materials, and the design of new ones, is discussed through their use in multiscale modelling, digital twinning, material informatics and machine learning frameworks.
</p>
},
	keywords = {Biology, Life sciences, Materials science, Scanning electron microscopy, Serial sectioning},
	issn = {13590286},
	doi = {10.1016/j.cossms.2020.100817},
	url = {https://doi.org/10.1016/j.cossms.2020.100817},
	author = {Echlin, Mclean P. and Burnett, Timothy L. and Polonsky, Andrew T. and Pollock, Tresa M. and Withers, Philip J.}
}
@article {1431,
	title = {Advanced detector signal acquisition and electron beam scanning for high resolution SEM imaging},
	journal = {Ultramicroscopy},
	volume = {195},
	year = {2018},
	pages = {93{\textendash}100},
	abstract = {<p>
	The advancement of materials science at the mesoscale requires improvements in both sampling volumes/areas and spatial resolution in order to make statistically significant measurements of microstructures that influence higher-order material properties, such as fatigue and fracture. Therefore, SEM-based techniques have become desirable due to improvements in imaging resolution, large sample handling capability, and flexibility for in-situ instrumentation. By using fast sampling of SEM electron detector signals, intrinsic beam scanning defects have been identified that are related to the response time of the SEM electron beam deflectors and electron detectors. Mitigation of these beam scanning defects using detector sampling approaches and an adaptive model for settling time is shown to produce higher resolution SEM images, at faster image acquisition times, with a means to quantify the different response functions for various beam deflectors and detectors including those for electrons and ions.
</p>
},
	keywords = {High resolution digital image correlation, Image processing, Imaging defects, Scan generator, Scanning electron microscopy, SEM},
	issn = {18792723},
	doi = {10.1016/j.ultramic.2018.08.025},
	url = {https://doi.org/10.1016/j.ultramic.2018.08.025},
	author = {Lenthe, William C. and Stinville, Jean Charles and Echlin, Mclean P. and Chen, Zhe and Daly, Samantha and Pollock, Tresa M.}
}
