@conference {1611,
	title = {Creep, Fatigue, and Oxidation Interactions During High and Very High Cycle Fatigue at Elevated Temperature of Nickel-Based Single Crystal Superalloys},
	booktitle = {Superalloys 2020},
	year = {2020},
	abstract = {<p>
	High-temperature fatigue of Ni-based single crystal superalloys is studied at 1000 \&deg;C in a wide range of loading conditions (\&minus;1 ? R ? 0.8) and number of cycles (103 \&minus; 109). Under fully reversed conditions, a competition between crack initiations from the surface\&mdash; assisted by oxidation\&mdash;and from internal metallurgical defects\&mdash;mostly large casting pores\&mdash;is observed. Increasing the testing frequency shifts the competition to a higher number of cycles. Conversely, decreasing the casting pore size or coating the specimen promotes surface initiations. When a positive mean stress is added (R ? 0), a creep deformation/damage mechanism mainly controls fatigue life, despite fracture surfaces presenting a variety of initiation types. Fatigue life can be predicted by a simple creep law if the contribution of the alternating stress is considered. A linear damage summation method that considers pure fatigue and pure creep damage is used to predict the fatigue lives, and Haigh diagrams for different alloys are presented.
</p>
},
	keywords = {Creep, fatigue, High temperature, Superalloy},
	isbn = {9783030518349},
	doi = {10.1007/978-3-030-51834-9},
	url = {http://dx.doi.org/10.1007/978-3-030-51834-9_65},
	author = {Cervellon, A. and Yi, J. Z. and Corpace, F. and Hervier, Z. and Rigney, J. and Wright, P. K. and Torbet, C. J. and Cormier, J. and Jones, J. W. and Pollock, T. M.},
	editor = {Tin, Sammy and Hardy, Mark and Clews, Justin and Cormier, Jonathan and Feng, Qiang and Marcin, John and O{\textquoteright}Brien, Chris and Suzuki, Akane}
}
@article {1436,
	title = {Measurements of plastic localization by heaviside-digital image correlation},
	journal = {Acta Materialia},
	volume = {157},
	year = {2018},
	pages = {307{\textendash}325},
	abstract = {<p>
	In polycrystalline metallic materials, quantitative and statistical assessment of the plasticity in relation to the microstructure is necessary to understand the deformation processes during mechanical loading. Plastic deformation often localizes into physical slip bands at the sub-grain scale. Detrimental microstructural configurations that result in the formation and evolution of slip bands during loading require advanced strain mapping techniques for the identification of these atomically sharp discontinuities. A new discontinuity-tolerant DIC method, Heaviside-DIC, has been developed to account for discontinuities in the displacement field. Displacement fields have been measured at the scale of the physical slip bands over large areas in nickel-based superalloys by high resolution scanning electron microscopy digital image correlation (SEM DIC). However, conventional DIC methods cannot quantitatively measure plastic localization in the presence of discontinuous kinematic fields such as those produced by slip bands. The Heaviside-DIC technique can autonomously detect discontinuities, providing information about their location, inclination, and identify slip systems (in combination with orientation mapping). Using Heaviside-DIC, discontinuities are physically evaluated as sharp shear-localization events, allowing for the quantitative measure of strain amplitude nearby the discontinuities. Measurements using the new Heaviside-DIC technique are compared to conventional DIC methods for identical materials and imaging conditions.
</p>
},
	keywords = {Discontinuities measurements, High resolution digital image correlation, Ren{\'e} 88DT polycrystalline superalloy, Scanning electron microscopy, Slip band offset, Slip band shearing, Slip system identification, Strain localization},
	issn = {13596454},
	doi = {10.1016/j.actamat.2018.07.013},
	url = {https://doi.org/10.1016/j.actamat.2018.07.013},
	author = {Bourdin, F. and Stinville, J. C. and Echlin, M. P. and Callahan, P. G. and Lenthe, W. C. and Torbet, C. J. and Texier, D. and Bridier, F. and Cormier, J. and Villechaise, P. and Pollock, T. M. and Valle, V.}
}
