Publications
Materials, Processing, and Testing of Flexible Image Sensor Arrays." IEEE DESIGN & TEST OF COMPUTERS 28 (2011): 16-22.
"Gate bias stress effects due to polymer gate dielectrics in organic thin-film transistors." JOURNAL OF APPLIED PHYSICS 103 (2008): 044506.
"Flexible image sensor array with bulk heterojunction organic photodiode." APPLIED PHYSICS LETTERS 92 (2008): 213303.
"Comparing the kinetics of bias stress in organic field-effect transistors with different dielectric interfaces." JOURNAL OF APPLIED PHYSICS 100 (2006): 084505.
"Flexible a-Si : H-based image sensors fabricated by digital lithography." In AMORPHOUS AND POLYCRYSTALLINE THIN-FILM SILICON SCIENCE AND TECHNOLOGY 2007, edited by V Chu, S Miyazaki, A Nathan, J Yang and HW Zan, 199-203. Vol. 989. MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS 989. 506 KEYSTONE DRIVE, WARRENDALE, PA 15088-7563 USA: Mat Res Soc, 2007.
"Characterization of Flexible Image Sensor Arrays with Bulk Heterojunction Organic Photodiodes." In ORGANIC FIELD-EFFECT TRANSISTORS VII AND ORGANIC SEMICONDUCTORS IN SENSORS AND BIOELECTRONICS, edited by Z Bao, I. McCulloch, R Shinar and GG Malliaras, 70541M. Vol. 7054. PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) 7054. 1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA: SPIE; Air Prod & Chem; Dai Nippon Printing Co Ltd; HC Stark GmbH; Hitachi Cambridge Lab; Merck Chem Ltd; Plast Logic Lt; Sigma Aldrich Co, 2008.
"Bias stress effects in organic thin film transistors." In 2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL, 243+. International Reliability Physics Symposium. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2007.
"Materials and Novel Patterning Methods for Flexible Electronics." In FLEXIBLE ELECTRONICS: MATERIALS AND APPLICATIONS, edited by W.S. Wong and A. Salleo, 143-181. Electronic Materials Science and Technology. PO BOX 17, 3300 AA DORDRECHT, NETHERLANDS: SPRINGER, 2009.
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